Wafer Level 3-D ICS Process Technology
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Book Overview
This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs...
Format:Hardcover
Language:English
ISBN:0387765328
ISBN13:9780387765327
Release Date:September 2008
Publisher:Springer
Length:410 Pages
Weight:1.45 lbs.
Dimensions:0.9" x 6.2" x 9.3"
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