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Paperback Through Silicon Vias: Materials, Models, Design, and Performance Book
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ISBN: 0367574543

ISBN13: 9780367574543

Through Silicon Vias: Materials, Models, Design, and Performance

by , , , et al.
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Format: Paperback

Condition: New

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Book Overview

Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and ph

Related Subjects

Computers Computers & Technology Engineering Science Science & Math Science & Scientists Science & Technology Technology

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