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Paperback Through Silicon Vias: Materials, Models, Design, and Performance Book
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ISBN: 0367574543

ISBN13: 9780367574543

Through Silicon Vias: Materials, Models, Design, and Performance

by , , , et al.
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Book Overview

Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene...

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Computers Computers & Technology Engineering Science Science & Math Science & Scientists Science & Technology Technology

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