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Hardcover Through-Silicon Vias for 3D Integration Book
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ISBN: 0071785140

ISBN13: 9780071785143

Through-Silicon Vias for 3D Integration

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Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.
A comprehensive guide to TSV and other enabling technologies for 3D integration

Written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edgeinformation on TSV, wafer...

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Format: Hardcover

Condition: New

$179.00
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Engineering Technology

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