Three Dimensional System Integration: IC Stacking Process and Design

by Riko Radojcic and Antonis Papanikolaou

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The next step in system integration: the benefits of going 3-D.- Process technology for manufacturing Through-Silicon Vias (TSVs).- Alternative 3D integration schemes.- Manufacturing issues in 3D stacked ICs.- TSV characterization.- Physical design of 3D stacked ICs.- DRAM on logic stacking.- 3D general purpose micro-processors.- 3D system design: a holistic design approach.

Format:Hardcover

Language:English

ISBN:1441909613

ISBN13:9781441909619

Release Date:December 2010

Publisher:Springer

Length:246 Pages

Weight:1.26 lbs.

Dimensions:0.8" x 6.1" x 9.2"

Related Subjects

Architecture Computers Computers & Technology Engineering Technology

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Three Dimensional System Integration: IC Stacking Process and Design

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