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Hardcover Three Dimensional System Integration: IC Stacking Process and Design Book
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ISBN: 1441909613

ISBN13: 9781441909619

Three Dimensional System Integration: IC Stacking Process and Design

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Format: Hardcover

Condition: Very Good

$55.89
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Book Overview

The next step in system integration: the benefits of going 3-D.- Process technology for manufacturing Through-Silicon Vias (TSVs).- Alternative 3D integration schemes.- Manufacturing issues in 3D stacked ICs.- TSV characterization.- Physical design of 3D stacked ICs.- DRAM on logic stacking.- 3D general purpose micro-processors.- 3D system design: a holistic design approach.

Related Subjects

Architecture Computers Computers & Technology Engineering Technology

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