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Paperback Testing of Interposer-Based 2.5d Integrated Circuits Book

ISBN: 3319854615

ISBN13: 9783319854618

Testing of Interposer-Based 2.5d Integrated Circuits

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Format: Paperback

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Book Overview

This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This...

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