Solder Joint Technology: Materials, Properties, and Reliability

by King-Ning Tu

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Solder joints are ubiquitous in electronic consumer products. With the European Union's directive to ban the use of lead-based (Pb) solders in these products, there is an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. For example, spontaneous Sn whisker growth and electromigration-induced failure in solder joints are serious issues. Analyzing...

Format:Hardcover

Language:English

ISBN:0387388907

ISBN13:9780387388908

Release Date:August 2007

Publisher:Springer

Length:370 Pages

Weight:1.46 lbs.

Dimensions:0.9" x 6.5" x 9.2"

Related Subjects

Engineering Technology

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Solder Joint Technology: Materials, Properties, and Reliability

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