Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch Smt Assemblies

Name: Good
Item: Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies
Rating: 4
Author: Thriftbooks.com User

by Yi-Hsin Pao and John H. Lau

Dealing with BGA, CSP, flip chips and other new technologies that underlie the electronics industry's need for smaller, faster products, this text explains the fundamentals of solder joint reliability... This description may be from another edition of this product.

Format:Hardcover

Language:English

ISBN:0070366489

ISBN13:9780070366480

Release Date:September 1996

Publisher:McGraw-Hill Professional Publishing

Length:408 Pages

Weight:1.86 lbs.

Dimensions:1.4" x 6.3" x 9.3"

Related Subjects

Engineering Technology

Customer Reviews

1 rating

Write a review

Good

Published by Thriftbooks.com User , 14 years ago

The book was in great condition and came on time. It is actually a very good first foundation book.

ThriftBooks sells millions of used books at the lowest everyday prices. We personally assess every book's quality and offer rare, out-of-print treasures. We deliver the joy of reading in recyclable packaging with free standard shipping on US orders over $15. ThriftBooks.com. Read more. Spend less.

Copyright © 2024 Thriftbooks.com Terms of Use | Privacy Policy | Do Not Sell/Share My Personal Information | Cookie Policy | Cookie Preferences | Accessibility Statement
ThriftBooks^® and the ThriftBooks^® logo are registered trademarks of Thrift Books Global, LLC

Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch Smt Assemblies

Recommended

Customer Reviews

Good

Popular Categories

Website

My Account

Partnerships

Quick Help

About Us

Follow Us