Sip System-In-Package Design and Simulation: Mentor Ee Flow Advanced Design Guide

by Sunyli Yang and Liu Yang

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An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking),...

Format:Hardcover

Language:English

ISBN:1119045932

ISBN13:9781119045939

Release Date:July 2017

Publisher:Wiley

Length:400 Pages

Weight:2.00 lbs.

Dimensions:1.2" x 6.9" x 9.7"

Related Subjects

Engineering Technology

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Sip System-In-Package Design and Simulation: Mentor Ee Flow Advanced Design Guide

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