Selected Soldering and Brazing Systems
(Part of the Landolt Bornstein: Numerical Data And Functional Relationships In Science And Technology New Series Series)
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Introduction. Ternary Systems: Ag-Bi-Cu, Ag-Bi-Sn, Ag-Cu-In, Ag-Cu-Mn, Ag-Cu-Ni, Ag-Cu-P, Ag-Cu-Sn, Ag-Cu-Ti, Ag-Cu-Zn, Ag-In-Sb, Ag-In-Sn, Ag-Pb-Sn, Ag-Sn-Zn, Au-Bi-Sn, Au-Cu-Sn, Au-In-Sn, B-Cr-Ni, Bi-In-Sb, Bi-In-Sn, Bi-Sn-Zn, Co-Cu-Mn, Cr-Ni-P, Cr-Ni-Si, Cu-In-Sn, Cu-Mn-Ni, Cu-Mn-Sn, Cu-Ni-Sn, Cu-Ni-Zn, Cu-P-Sn, Cu-Pb-Sn, Cu-Pd-Sn, Cu-Si-Zn, Cu-Sn-Ti, Cu-Sn-Zn, Cu-Ti-Zr, In-Ti-Zn, Mn-Ti-Zr, Ni-Pd-Si.
Format:Hardcover
Language:English
ISBN:3540257772
ISBN13:9783540257776
Release Date:January 2007
Publisher:Springer
Length:493 Pages
Weight:3.30 lbs.
Dimensions:1.8" x 8.1" x 11.3"
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