Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling

by Yong Liu

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Book Overview

Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly, reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic...

Format:Paperback

Language:English

ISBN:1489987975

ISBN13:9781489987976

Release Date:April 2014

Publisher:Springer

Length:594 Pages

Weight:1.86 lbs.

Dimensions:1.2" x 6.1" x 9.2"

Related Subjects

Engineering Science Science & Math Science & Scientists Science & Technology Technology

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Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling

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