Physical Design for Multichip Modules

by Mysore Sriram, Sung-Mo Kang, Sung-Mo (Steve) Kang

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Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material consists of a survey of published results as well as original work by the authors. All major aspects of MCM physical design are discussed, including interconnect analysis and modeling, system partitioning and placement, and multilayer routing. For readers...

Format:Paperback

Language:English

ISBN:1461361532

ISBN13:9781461361534

Release Date:October 2012

Publisher:Springer

Length:197 Pages

Weight:0.68 lbs.

Dimensions:0.5" x 6.1" x 9.2"

Related Subjects

Architecture Arts, Music & Photography CAD Computer Science Computers Computers & Technology Drafting & Presentation Electrical & Electronics Engineering Graphic Design Technology Textbooks

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