Packaging of High Power Semiconductor Lasers

by Xingsheng Liu, Wei Zhao, Lingling Xiong, et al.

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This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.

Format:Hardcover

Language:English

ISBN:1461492629

ISBN13:9781461492627

Release Date:July 2014

Publisher:Springer

Length:402 Pages

Weight:1.68 lbs.

Dimensions:0.9" x 6.1" x 9.2"

Related Subjects

Engineering Technology

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Packaging of High Power Semiconductor Lasers

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