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Hardcover Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module: Ceramic Research and Development in Japan Book
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ISBN: 185166579X

ISBN13: 9781851665792

Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module: Ceramic Research and Development in Japan

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This book is a translation of an important Japanese work on electronic ceramics and includes much experimental data. It will be of great interest to ceramicists and electronic engineers working with... This description may be from another edition of this product.

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Format: Hardcover

Condition: New

$323.34
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Computers Computers & Technology Engineering Technology

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