Low Cost Flip Chip Technologies for Dca, Wlcsp, and Pbga Assemblies

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Low-Cost Flip Chip Technologies:For DCA, WLCSP, and PBGA AssembliesJohn H. LauThe first comprehensive and in-depth guide to low-cost flip chip technologies, this reference gives you cutting edge... This description may be from another edition of this product.

Format:Hardcover

Language:English

ISBN:0071351418

ISBN13:9780071351416

Release Date:February 2000

Publisher:McGraw-Hill Professional Publishing

Length:585 Pages

Weight:2.50 lbs.

Dimensions:1.8" x 6.3" x 9.3"

Related Subjects

Engineering Technology

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Low Cost Flip Chip Technologies for Dca, Wlcsp, and Pbga Assemblies

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