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Hardcover Lead-Free Solder Process Development Book
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ISBN: 0470410744

ISBN13: 9780470410745

Lead-Free Solder Process Development

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Format: Hardcover

Condition: New

$121.26
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Book Overview

Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks

This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed...

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Engineering Home & Garden House & Home Technology

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