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Hardcover Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability Book
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ISBN: 0471594466

ISBN13: 9780471594468

Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability

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Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals.

Its uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service management shows you step-by-step how to:
* Define...

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Format: Hardcover

Condition: New

$186.90
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List Price $212.95
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Electrical & Electronics Engineering Technology

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