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Hardcover Force Sensors for Microelectronic Packaging Applications Book
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ISBN: 3540221875

ISBN13: 9783540221876

Force Sensors for Microelectronic Packaging Applications

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Format: Hardcover

Condition: New

$109.99
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Book Overview

Intended for wire-bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors, this practical monograph introduces novel measurement... This description may be from another edition of this product.

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Engineering Technology

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