Flip Chip Technologies

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'Flip Chip' has come to describe a group of related technologies that are used for connecting a chip to a substrate without the use of wires. Instead of using traditional wire leads, the chip is... This description may be from another edition of this product.

Format:Hardcover

Language:English

ISBN:0070366098

ISBN13:9780070366091

Release Date:December 1995

Publisher:McGraw-Hill Professional Publishing

Length:565 Pages

Weight:1.95 lbs.

Dimensions:1.1" x 6.2" x 9.3"

Related Subjects

Engineering Technology

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Flip Chip Technologies

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