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Hardcover Fan-Out Wafer-Level Packaging Book
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ISBN: 9811088837

ISBN13: 9789811088834

Fan-Out Wafer-Level Packaging

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Format: Hardcover

Condition: New

$159.99
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Book Overview

Patent Issues of Fan-out Wafer-Level Packaging.- Flip Chip Technology vs. FOWLP.- Fan-In Wafer-Level Packaging vs. FOWLP.- Embedded Chip Packaging.- FOWLP: Chip-First and Die Face-Down.- FOWLP: Chip-First and Die Face-Up.- FOWLP: Chip-Last or RDL-First.- FOWLP: PoP with FOWLP.- Fan-Out Panel-Level Packaging (FOPLP).- 3D Integration.- Heterogeneous Integration.

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Engineering Science Science & Math Science & Scientists Science & Technology Technology

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