Electronic Packaging: Design, Materials, Process, and Reliability

by John H. Lau and C.P. Wong

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Intended to be an electronic packaging resource, this text features writing from four leaders in the the four intertwined disciplines of packaging. Recent technological advances are discussed,... This description may be from another edition of this product.

Format:Hardcover

Language:English

ISBN:0070371350

ISBN13:9780070371354

Release Date:February 1998

Publisher:McGraw-Hill Professional Publishing

Length:498 Pages

Weight:1.95 lbs.

Dimensions:1.6" x 6.3" x 9.3"

Related Subjects

Engineering Technology

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Electronic Packaging: Design, Materials, Process, and Reliability

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