Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC

by Er-Ping Li

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New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems

Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package structures, integrated circuits, and...

Format:Hardcover

Language:English

ISBN:0470623462

ISBN13:9780470623466

Release Date:April 2012

Publisher:Wiley-IEEE Press

Length:384 Pages

Weight:1.67 lbs.

Dimensions:1.2" x 6.1" x 9.4"

Related Subjects

Engineering Science Science & Math Science & Scientists Science & Technology Technology

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Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC

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