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Hardcover Design-For-Test and Test Optimization Techniques for Tsv-Based 3D Stacked ICS Book
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ISBN: 3319023772

ISBN13: 9783319023779

Design-For-Test and Test Optimization Techniques for Tsv-Based 3D Stacked ICS

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Format: Hardcover

Condition: New

$109.99
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Book Overview

This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects. The authors identify... This description may be from another edition of this product.

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Computers Computers & Technology Engineering Technology

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