Copper Interconnect for Silicon ULSI Seedless Copper Electrochemical Deposition for ULSI - Interconnect

by Sunjung Kim

No Customer Reviews

No Synopsis Available.

Format:Paperback

Language:English

ISBN:3639111303

ISBN13:9783639111309

Release Date:December 2008

Publisher:VDM Verlag

Length:144 Pages

Weight:0.44 lbs.

Dimensions:0.3" x 6.0" x 9.0"

Related Subjects

Engineering Technology

Customer Reviews

0 rating

Write a review

ThriftBooks sells millions of used books at the lowest everyday prices. We personally assess every book's quality and offer rare, out-of-print treasures. We deliver the joy of reading in recyclable packaging with free standard shipping on US orders over $15. ThriftBooks.com. Read more. Spend less.

Copyright © 2024 Thriftbooks.com Terms of Use | Privacy Policy | Do Not Sell/Share My Personal Information | Cookie Policy | Cookie Preferences | Accessibility Statement
ThriftBooks^® and the ThriftBooks^® logo are registered trademarks of Thrift Books Global, LLC

Copper Interconnect for Silicon ULSI Seedless Copper Electrochemical Deposition for ULSI - Interconnect

Recommended

Customer Reviews

Popular Categories

Website

My Account

Partnerships

Quick Help

About Us

Follow Us