Chip Scale Package: Design, Materials, Process, Reliability, and Applications

by Ricky S.W. Lee, John H. Lau, S.W. Ricky Lee

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This text details current trends in CSP (Chip Scale Packaging) design and developments, covering each major type, chip scale and package developed by each major vendor, detailing the efficiency and... This description may be from another edition of this product.

Format:Hardcover

Language:English

ISBN:0070383049

ISBN13:9780070383043

Release Date:February 1999

Publisher:McGraw-Hill Professional Publishing

Length:564 Pages

Weight:2.42 lbs.

Dimensions:1.8" x 6.3" x 9.3"

Related Subjects

Engineering Technology

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Chip Scale Package: Design, Materials, Process, Reliability, and Applications

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