Characterization of Integrated Circuit Packaging Materials

No Customer Reviews

With a particular emphasis on fabrication quality control, this volume in the Materials Characterization series focuses on characterization techniques used for critical junctures in package design... This description may be from another edition of this product.

Format:Hardcover

Language:English

ISBN:1606501879

ISBN13:9781606501870

Release Date:March 2010

Publisher:Momentum Press

Length:274 Pages

Weight:1.28 lbs.

Dimensions:0.7" x 6.3" x 9.5"

Related Subjects

Engineering Technology

Customer Reviews

0 rating

Write a review

ThriftBooks sells millions of used books at the lowest everyday prices. We personally assess every book's quality and offer rare, out-of-print treasures. We deliver the joy of reading in recyclable packaging with free standard shipping on US orders over $15. ThriftBooks.com. Read more. Spend less.

Copyright © 2024 Thriftbooks.com Terms of Use | Privacy Policy | Do Not Sell/Share My Personal Information | Cookie Policy | Cookie Preferences | Accessibility Statement
ThriftBooks^® and the ThriftBooks^® logo are registered trademarks of Thrift Books Global, LLC

Characterization of Integrated Circuit Packaging Materials

Recommended

Customer Reviews

Popular Categories

Website

My Account

Partnerships

Quick Help

About Us

Follow Us