Characterization of Integrated Circuit Packaging Materials

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With a particular emphasis on fabrication quality control, this volume in the Materials Characterization series focuses on characterization techniques used for critical junctures in package design... This description may be from another edition of this product.

Format:Hardcover

Language:English

ISBN:1606501879

ISBN13:9781606501870

Release Date:March 2010

Publisher:Momentum Press

Length:274 Pages

Weight:1.28 lbs.

Dimensions:0.7" x 6.3" x 9.5"

Related Subjects

Engineering Technology

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Characterization of Integrated Circuit Packaging Materials

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