3D IC Integration and Packaging

by John H. Lau and John H Lau

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A comprehensive guide to 3D IC integration and packaging technology
3D IC Integration and Packaging fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Based on a course developed by its author, this practical guide offers real-world problem-solving methods and teaches the trade-offs inherent in making system-level decisions. Explore key enabling...

Format:Hardcover

Language:English

ISBN:0071848061

ISBN13:9780071848060

Release Date:August 2015

Publisher:McGraw-Hill Companies

Length:480 Pages

Weight:2.24 lbs.

Dimensions:1.2" x 7.5" x 9.3"

Related Subjects

Engineering Technology

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3D IC Integration and Packaging

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