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Hardcover 3D IC and RF Sips: Advanced Stacking and Planar Solutions for 5g Mobility Book

ISBN: 1119289645

ISBN13: 9781119289647

3D IC and RF Sips: Advanced Stacking and Planar Solutions for 5g Mobility

An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments

Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft's Excel and Minitab Fundamental design topics such as electromagnetic design...

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Format: Hardcover

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