Most Popular Books
- Guidebook for Managing Silicon Chip Reliability (Electronic Packaging Series)
- Three Dimensional System Integration: IC Stacking Process and Design
- Stress Management for 3D ICS Using Through Silicon Vias:: International Workshop on Stress Management for 3D ICS Using Through Silicon Vias
- More-than-Moore 2.5D and 3D SiP Integration
- Managing More-than-Moore Integration Technology Development: A Story of an Advanced Technology Program in the Semiconductor Industry
