Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies
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Electronic Packaging: Design, Materials, Process, and Reliability
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Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)
$26.89 - $219.99
Solder Joint Reliability: Theory and applications
$36.99 - $219.99
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies
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Mechanics of Solder Alloy Interconnects (Electrical Engineering)
$90.09 - $219.99
Ball Grid Array Technology
$12.79
Flip Chip Technologies
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Microvias: For Low Cost, High Density Interconnects
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Handbook Of Tape Automated Bonding
$25.99 - $219.99
Electronics Manufacturing : with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials
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Handbook Of Fine Pitch Surface Mount Technology (Electrical Engineering)
$15.09
Chip Scale Package: Design, Materials, Process, Reliability, and Applications
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Reliability of RoHS-Compliant 2D and 3D IC Interconnects
$141.81
Through-Silicon Vias for 3D Integration
$179.00
Advanced MEMS Packaging
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3D IC Integration and Packaging
$218.00
Heterogeneous Integrations
$169.99
Semiconductor Advanced Packaging
$119.99 - $179.99
Assembly and Reliability of Lead-Free Solder Joints
$129.99
Chiplet Design and Heterogeneous Integration Packaging
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